根據DIGITIMES Research分析師柴煥欣分析, 2010年全球前十大晶圓代工廠商排名中,臺積電(TSMC)、聯電(UMC)以全年營收132.3億美元與38.6億美元,分別拿下第一名與第二名,中芯(SMIC)則以15.5億美元全年營收,居于第四名位置。 至于臺積電旗下轉投資公司世界先進(Vanguard International Semiconductor)則以5億美元全年營收,亦擠身于全球前十大晶圓代工廠商之列。 柴煥欣說明, 2010年全球前十大晶圓代工廠排名中,大中華地區即占4席,而大中華地區前四大晶圓代工廠,在 2010年全球晶圓代工產業合計市占率高達73%,亦突顯出大中華地區在晶圓代工產業地位之重要性。 然而, GlobalFoundries 挾中東阿布達比先進技術投資公司(ATIC)雄厚資金,除購并全球第三大晶圓代工廠特許半導體(Chartered)外,還于美國紐約州興建第三座 12吋晶圓廠Fab-8,生產制程更從28nm起跳,目標就是希望超越臺積電,成為全球最大晶圓代工廠。GlobalFoundries加入競爭,掀起晶圓代工產業新一波12吋晶圓廠產能擴充競賽。 包括臺積電、聯電、中芯等晶圓代工廠于2010年皆相繼調高資本支出金額,柴煥欣分析,除加快 12吋晶圓產能擴充腳步外,為爭取更廣大訂單機會,亦為掌握整合組件廠(IDM)訂單擴大委外代工的趨勢,提高45/40nm及其以下先進制程產出比重,購置浸潤式機臺亦是資本支出另一個重要方向。 在大中華地區主要晶圓代工廠投入 12吋晶圓與先進制程產能擴充的同時,展望 2011年半導體產業景氣,在 2010年下半客戶端庫存調整后,DIGITIMES Research預期 2011年依然會延續景氣成長的方向前進,但歷經2009年下半以來高成長期后,2011年將會成長趨緩,回歸至穩定成長的軌跡。 需求成長幅度預估供給相當,柴煥欣預估2011年大中華地區前四大晶圓代工業者營收年成長率將達9.4%,但在12吋晶圓產能與45/40nm及其以下先進制程良率與研發進度擁有優勢的臺積電,全球市占率版圖將會進一步擴張。 |
Fab資產投入2011年將增長18%,但新Fab的建設前景不確定。 根據最新版“全球Fab預測”,SEMI預測2010年和2011年Fab裝機容量年增長8%,2012年增長9%。這一預測是根據各Fab公布的產能擴充計劃和有關Fab的投資計劃分析而得。與2003到2007年間兩位數增長率相比,這一增長率是適度的。 SAN JOSE, Calif. — December 7, 2010 — According to the latest edition of the World Fab Forecast, SEMI predicts 8 percent annual growth in installed fab capacity for 2010 and 2011 and about 9 percent for 2012. This projection is based on input of announced capacity plans and other analysis regarding needed fabs investments. These increases are modest compared to double-digit growth rates seen each year from 2003 to 2007. Looking at year-over-year capacity growth by industry segment since 2004, the LED segment stands out — with double-digit installed capacity growth rates for the past six years. In the past, the Memory segment led growth, with growth rates twice as high as foundries. Through 2012, Memory capacity is expected to increase at the same rate as foundries. Fab spending is expected to increase by 18.3 percent in 2011 and by 9.5 percent in 2012 as a result of on-going technology upgrades and continued capacity growth, especially for Memory, Foundries and MPU. Total fab spending for 2011 is pulled down by an 11 percent drop in spending on construction projects. This trend will accelerate in 2012, with a currently uncertain outlook for new fab construction starts. While spending on construction projects declines, spending on Fab Equipment is forecast to rise 23 percent, reaching about $40 billion in 2011. With $40 billion in equipment spending, 2011 will surpass the spending levels of 2007, showing the highest spending on fab equipment in the 19-year history of the SEMI World Fab database. For 2010, the industry segment with the most growth in equipment spending will be Memory, followed by foundries and MPU. “A sharp decline in the number of new fabs being built in 2011 and 2012 raises some concerns for the industry,” said Christian Gregor Dieseldorff, senior analyst of fab information of the SEMI Industry Research and Statistics group. “It takes 18 to 24 months to plan, construct, equip, qualify, and ramp a new fab. The industry may not have enough capacity in the next two years, as new fabs slowly come on line.” Many companies seem to be waiting for additional proof that the market has stabilized. In the NAND market, one of the largest growth segments, new applications and electronic devices will result in increased demand. Lower prices for NAND will even accelerate this demand and stimulate continued growth. The SEMI World Fab Forecast report uses a bottom-up approach as methodology, providing from high-level summaries and graphs; in-depth analyses of capital expenditure, capacity, technology and products; down to the detail of each fab; and forecasts for the next 18 months by quarter. These tools are invaluable for understanding how 2011 and 2012 will look, and learning more about capex for construction projects, fab equipping, technology level, and products. The SEMI Worldwide Semiconductor Equipment Market Subscription (WWSEMS) data tracks only new equipment. However, the World Fab Forecast and its related Fab Database reports track any equipment needed to ramp fabs, upgrade technology nodes, and expand or change wafer size, whether new equipment, used equipment, or in-house equipment. |
TSMC還是執牛耳 |