PCB及PCBA缺陷中英文對(duì)照表 PCB制作流程英語(yǔ)表達(dá)

premier_nana

1內(nèi)層開路Inner open　
2內(nèi)層斷路Inner short　
3外層開路Outer open　
4外層斷路Outer short　
5內(nèi)層蝕刻過度Inner over ecthing　
6外層蝕刻過度Outer over ecthing　
7內(nèi)層樹脂氣泡Resin void　
8內(nèi)層雜物Foreign material　
9內(nèi)層圖形移位Inner pattern mis-registration　
10層與層移位Layer to layer mis-registration　
11打孔不良Improper targeting　
12內(nèi)層蝕刻不凈Inner under etching　
13露布紋Weave texture/exposure　
14檫花（氧化膜面）Scratch(Oxide surface)　
15板損壞Damaged board　
16分層（物料）Delamination (Raw material)　
17內(nèi)層不配套Excessive inner core　
18板過厚Over thickness　
19白點(diǎn)（壓板）Measling (Pressing)　
20白點(diǎn)（噴錫）Measling (HSAL)　
21板曲Warpage　
22板焦黃Burnt　
23起皺Wrinkle　
24起泡（壓板）Blistering (Pressing)　
25鍍層起泡Blistering (Cu plating)　
26噴錫起泡Blistering (HSAL)　
27板面凹痕DENT (Pressing profilling G/F)　
28白斑Crazing　
29膠渣Gum residue　
30孔未穿Incomplete drilling　
31披鋒Burr　
32多孔Extra hole　
33偏孔Hole shift　
34孔徑大Hole oversize　
35孔徑小Hole undersize　
36少孔Missing Hole　
37塞孔Block hole　
38崩孔Hole breakout　
39孔粗糙(鍍銅）Hole roughness（Cu plating)　
40孔粗糙（機(jī)械鉆孔）Hole roughness(mechanical drill)　
41崩線、線路缺口Nick　/　void on trace　
42缺口Nick　/　void on pad　
43曝光過度Over-exposure　
44曝光不良Under exposure　
45顯影不足Under develop　
46干膜脫落D/F Peel off　
47干膜碎D/F Rdsidue　
48干膜移位D/F Mis-registration　
49標(biāo)志不清（曝光）Illegible marking (exposure)　
50錯(cuò)菲林Wrong A/W　
51非鍍銅孔有銅Copper in NPTH　
52鍍銅孔內(nèi)無(wú)銅No copper in PTH　
53滲鍍Nickel smear　
54電鍍粗糙Rough plating　
55孔壁缺口Hole void (Cu)　
56金手指顏色不良Gold Finger discoloration　
57金面顏色不良Gold discoloration　
58金面陰陽(yáng)色Two tone colour on gold surface　
59銅、鎳脫落Copper/Nickel peel off　
60銅鍍層厚度超要求Copper thickness out of requirement　
61漏鍍（金手指等）Skip plating(G/F ENIG Cu)　
62金面污點(diǎn)Stain on gold surface　
63電鍍針孔Plating pits (Cu)　
64鍍錫缺點(diǎn)Tin plating defect　
65銅碎Copper residue　
66黑孔Black Hole　
67鍍層白漬Plating haze　
68金手指凸出Protrusion (G/F)　
69板污Board contamination　
70手指套Glove mark 　
71褪錫不良Improper Tin stripping　
72微短路Micro short　





流程簡(jiǎn)介：開料Cut Lamination－－鉆孔Drilling－－干膜制程Photo Process(D/F)－－壓合Lamination－－減銅Copper Reduction－－電鍍Horizontal Electrolytic Plating－－塞孔Plug Hole－－防焊(綠漆/綠油)Solder Mask－－鍍金Gold plating－－噴錫Hot Air Solder Leveling－－成型Profile－－開短路測(cè)試Electrical Testing－－終檢Final Visual Inspection



PCB英語(yǔ)術(shù)語(yǔ) PCB英語(yǔ)表達(dá) PCB制作流程英語(yǔ) PCB中英對(duì)照 PCB英語(yǔ)
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http://blog.sina.com.cn/u/1747420037

Cairo

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