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ZT: 大復活, 力晶砸百億提升制程

發布時間:2010-3-10 09:45    發布者:步從容
關鍵詞: 復活 , 制程
2010-03-10 工商時報【記者李淑惠/臺北報導】
    力晶通過今年度的資本支出計畫,預計在轉入40奈米制程之下,2010年度的資本支出將達100億元至110億元,與去年度幾乎沒有資本支出相較,呈現巨幅成長。如果加上力晶轉投資瑞晶的資本支出120億元,以及爾必達(Elpida)的600億日圓(212億元),泛爾必達聯盟2010年資本出合計432億元,攀上近年高峰。

    DRAM廠今年沒有新廠加入營運,在微軟Win7帶動的換機潮涌現,以及美商蘋果相繼推出新產品之下,今年DRAM供給有限成為市場共識,大廠沉寂已久的資本支出計畫也相繼浮現。

    力晶董事會昨(9)日通過2010年的資本支出計畫,力晶表示,資本支出規模落在100億元至110億元,主要還是用在轉進40奈米制程,去年度則因為上半年景氣仍舊不佳,幾乎沒有資本支出。

    力晶去年股東會時已經事先通過12億股額度之內,辦理現金增資,力晶有意在今年上半年完成該筆現增,對改善財務結構、每股凈值有相當程度幫助,惟力晶目前股本已高達873億元,若以現增方式籌資,恐有股本膨脹之嫌。

    今年國內外的DRAM廠都有大幅度的資本支出,除力晶、瑞晶已經公布之外,南科原定今年資本支出為190億元,然因南科規劃將12吋廠產能從3.6萬片增至5萬片,產能增幅高達39%,因此今年度的資本支出可望超越200億元大關;同一集團的華亞科因提前導入42奈米制程,今年度的資本支出也從450億元上修至520億元,資本支出規模高居國內DRAM廠之冠。

    從廠商在資本支出的規畫上來看,今年有相當程度的資本支出投入40奈米,力晶、瑞晶以45奈米為主,而南科、華亞科則提前一季導入42奈米,顯見景氣好轉不僅讓廠商恢復生機,也讓國內DRAM廠的40奈米競爭白熱化。
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步從容 發表于 2010-3-10 09:50:00
SanDisk begins to supply NAND flash wafers, say memory module makers
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Josephine Lien, Taipei; Jessie Shen, DIGITIMES [Tuesday 9 March 2010]

Taiwan-based NAND flash device makers including A-Data Technology, Transcend Information and Power Quotient International (PQI), and flash controller supplier Phison Electronics have begun to source NAND flash wafers from SanDisk, according to industry sources.

The sources claimed SanDisk has now become one of these players' upstream suppliers, along with its partner Toshiba. Speculation about SanDisk mulling changes to its strategy to sell NAND flash in wafer or die form has been circulating in the Taiwan memory sector since September 2008.

SanDisk is also looking to withdraw or settle NAND flash-related patent infringement lawsuits in the US against those Taiwan-based NAND flash device and controller chip makers who have become its customers, the sources said.

A-Data has issued a company filing with the Taiwan Stock Exchange (TSE) disclosing SanDisk has dropped a patent lawsuit against it. The announcement follows Phison's recent filing with the TSE indicating it has settled with SanDisk over a patent suit filed in the same US court.

SanDisk reportedly has also tapped the white-box market by supplying microSD cards to downstream device makers.
步從容 發表于 2010-3-10 09:50:58
Chip equipment spending to grow 76% in 2010, says Gartner
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Press release; Jessie Shen, DIGITIMES [Tuesday 9 March 2010]
2009 2010(e) 2011(f)  2012(f)  2013(f)   2014(f)
Semiconductor capital spending   25,934.9    40,429.9 51,291.5 61,898.6 54,167.5   52,953.2
Y/Y    -41.1% 55.9% 26.9%   20.7% -12.5% -2.2%
Capital equipment 16,677.1 29,372.6 36,413.3 42,919.6 35,694.2 35,965.5
Y/Y -45.6% 76.1% 24.0% 17.9% -16.8% 0.8%
Wafer fab equipment   12,976.8 22,924.7 28,793.3 34,351.3 29,176.7 28,581.6
Y/Y    -46.4%   76.7% 25.6% 19.3% -15.1% -2.0%
Packaging and assembly equipment   2,382.6 4,181.7 5,013.2 5,716.4 4,335.5 4,977.0
Y/Y    -40.4% 75.5% 19.9% 14.0% -24.2% 14.8%
Automated test equipment   1,317.7 2,266.2 2,606.8 2,851.9 2,182.1 2,406.8
Y/Y    -46.1% 72.0% 15.0% 9.4% -23.5% 10.3%
Other spending    9,257.8 11,057.3 14,878.2 18,979.0 18,473.3 16,987.8
  Y/Y   
-30.8% 19.4% 34.6% 27.6% -2.7%  -8.0%
Gartner: Global chip equipment spending forecast, 2009-2014 (US$m)
Source: Gartner, compiled by Digitimes, March 2010

Worldwide semiconductor capital equipment spending is projected to surpass US$29.4 billion in 2010, a 76.1% rise from 2009 spending of US$16.7 billion, according to Gartner.

"The dramatic semiconductor industry recovery rate over the last three quarters has necessitated a renewed growth for equipment spending," said Jim Walker, research vice president at Gartner. "Spending by the memory and foundry markets, along with the advancement to new technology nodes, will drive the semiconductor equipment segment in the first half of 2010. Quarterly growth will see a slight slowdown in the second half before capacity additions start ramping up the equipment industry again going into 2011."

Gartner estimated wafer fab equipment spending is set to grow 76.6% in 2010, following a 46.4% decline in 2009. The growth will be driven by aggressive technology upgrades, especially for the leading memory companies.

Packaging and assembly equipment (PAE) spending is forecast to increase by more than 75% in 2010, according to Gartner, adding that the growth is expected through 2012. The modest decline expected for 2013 is based on a more traditional inventory-based market contraction, the firm said.

On a regional basis, Gartner believes Asia Pacific will improve its share of PAE consumption throughout the forecast period. The region will account for nearly 85% of all PAE sales by 2014. China will be the largest individual consumer of PAE in 2012, accounting for nearly 27% of the total market that year.

According to Gartner, 2010 will also bring the worldwide automated test equipment (ATE) market its first positive growth year since 2006. After bottoming out in the first quarter of 2009, the ATE market has realized substantial quarterly gains and is expected to grow by more than 70% in 2010. Growth is expected to continue during the next several quarters as device demand improves, said Gartner, adding that its 2010 growth expectations are driven heavily by the expected transition to DDR3 memory devices.

"The semiconductor equipment industry will experience a very strong growth spurt in 2010, as we emerge from a very costly recession, and this growth is expected to continue throughout 2012," said Walker. "However, we expect this upturn to be one of the first in which the peak revenue in capital equipment does not surpass previous growth cycles, which may well help to mitigate the boom/bust scenario that we have seen in the past."
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