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日月光封裝測(cè)試（上海）有限公司 Manufacture Process Engineering Director 25K-35K 上海 10年以上 本科及以上 全職 職位誘惑: 良好的展平臺(tái)、優(yōu)沃的工作績(jī)效獎(jiǎng)金 職位描述： ob Description: 1.Lead an engineering team (60 to 70 engineers) to perform process and product qualifications for Lead Frame Type、PBGA packages 2.Work with Station & Manufactory PE team to implement new processes and products into production line 3.Work with customer to understand the customer requirements and to implement them in the process 4.Take in charge of conducting process evaluations and preparing reports including,FMEA, DOE(process windows), failure analysis and process specs. 5.Take in charge of engineering supports for Production sustaining. 6.Strong experience should be in the areas of Molding, laser scribing and laser marking for SiP packages. Qualification: 【Education Background】 1.BS degree or above in related engineering majors 2.Excellent interpersonal and communications skills in both Chinese & English 【W(wǎng)orking Experiences】 1.10 to 15 year experience in electronic packaging, engineering and manufacturing management. 2.Packaging back-end experiences are required, such as molding, laser marking / trimming / singulation, experience in SMT is a plus. 3.Experiences to work with English speaking customers. 【Requirements】 1.Project Management Skill 2.Communications skills in both Chinese & English 3.Strong multi-task skills and detail oriented 4.Able to work under pressure and complex environment 公司介紹： 日月光集團(tuán)為全球第一大半導(dǎo)體制造服務(wù)公司，長(zhǎng)期提供全球客戶最佳的服務(wù)與最先進(jìn)的技術(shù)。自1984年成立至今，專注于提供半導(dǎo)體客戶完整的封裝與測(cè)試服務(wù)，包括芯片前段測(cè)試及晶圓針測(cè)至后段之封裝、材料及成品測(cè)試的一元化服務(wù)。全球營(yíng)運(yùn)據(jù)點(diǎn)涵蓋臺(tái)灣、韓國(guó)、日本、馬來(lái)西亞、新加坡、中國(guó)、美國(guó)與歐洲多個(gè)國(guó)家與地區(qū)，全球員工人數(shù)超過(guò)三萬(wàn)人，2007年?duì)I業(yè)收入超過(guò) 31億美元。 日月光封裝測(cè)試（上海）有限公司為日月光集團(tuán)合資子公司，位于上海浦東張江高科技園區(qū)，投資數(shù)億美元建立了一個(gè)完整的封裝設(shè)計(jì)、組裝、測(cè)試廠區(qū)，并結(jié)合現(xiàn)有芯片制造商及IC設(shè)計(jì)公司，為客戶提供一站式全方位產(chǎn)品及服務(wù)。 |
