上海需要一位 Package Engineer_Sr Development COF
發(fā)布時(shí)間：2015-1-8 15:45
發(fā)布者：
KT咨詢
【獵頭職位：上海需要一位 Package Engineer_Sr Development COF】聯(lián)系人：Amy-Dong，郵箱：hr@kthr.com，微信也可查詢職位啦！打開手機(jī)微信，搜號(hào)碼“KTHR_COM”或查找微信公眾帳號(hào)“KT人才”或掃描以上二維碼即可添加，歡迎大家關(guān)注！
Responsibilities:
- Co-design package/modules with layout specialist
- Develop custom Chip on Flex package/modules with suppliers
- Develop and define assembly processes, troubleshoot and provide initial production ramp and sustaining support on packaging/module launch
- Communicate across groups within internal regarding needs in ramping up new technologies (manufacturing processes, materials, testing requirements, sourcing, etc.)
- Provide direction to chip designer during the developmental stage to design an optimum pad layout for most cost effective package
- Help assess manufacturability of new module and assembly technologies
- Manage logistics, materials and education needed to transfer new technologies into selected manufacturing sites; Work with marketing and chip lead to select packages and Define packaging cost and roadmap for new devices; Lead new packaging and process technology development and the deployment of the technology in HVM
- Work closely with QA and customer to resolve quality issues
- Interface with packaging vendors to identify quality, production and technology capabilities, technology improvement plans and cost reduction goals
- Travel to manufacturing sites to make assessments of their technical capability and report back to company
Required Experience:
- Minimum 7 years’ experience in semiconductor package development, layout and characterization. At least 2 years of Chip on Flex experience.
- BS or greater, preferably in Physics, Mechanical Engineering, Chemical Engineering, Material Science or a closely related field
- Excellent communication, reasoning and problem-solving skills
- Experience in manufacturing consumer electronics products
- Knowledge of manufacturing process control
- Experience with package and module development processes including writing specifications, design, and validation
- Solid background with hands on work ethic, team player with experience working across geographically diverse teams.
- Ability to work creatively and independently with minimum supervision following specifications and project schedule.
- Experiencewith tools used in package design and circuit, electromagnetic and thermalsimulation and characterization with especially strong authority on CadenceAPD/APE, ACAD for custom substrate and module design
- Niceto have these additional experiences:
- Background in sensor packaging
- Flip chip on laminate or flex substrate, SMT and Chip attach processes
- Flex substrate package development
- Materials processing including coating and molding
- Antenna radiation and ESD characterization and improvement
|
