Advanced MEMS Packaging
發布時間：2014-8-4 15:30
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A comprehensive guide to 3D MEMS packaging methods and solutions
Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging. This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging.
Advanced.MEMS.Packaging-McGrawHill(2010).pdf
(13.13 MB)
2014-8-4 15:27 上傳
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