|
|
Abietic Acid松脂酸.
Abrasion Resistance耐磨性.
Abrasives磨料,刷材.
ABS樹脂.
Absorption吸收(入).
Ac Impedance交流阻抗.
Accelerated Test(Aging)加速老化(試驗).
Acceleration速化反應.
Accelerator 加速劑,速化劑.
Acceptability,Acceptance 允收性,允收.
Access Hole露出孔,穿露孔.
Accuracy準確度.
Acid Number (Acid Value)酸值.
Acoustic Microscope (AM)感音成像顯微鏡.
Acrylic壓克力(聚丙烯酸樹脂).
Actinic Light (or Intensity, or Radiation)有效光.
Activation活化.
Activator活化劑.
Active Carbon活性炭.
Active Parts(Devices)主動零件.
Acutance解像銳利度.
Addition Agent添加劑.
Additive Process加成法.
Adhesion附著力.
Adhesion Promotor附著力促進劑.
Adhesive膠類或接著劑.
Admittance導納(阻抗的倒數).
Aerosol噴霧劑,氣熔膠,氣懸體.
Aging老化.
Air Inclusion氣泡夾雜.
Air Knife風刀.
Algorithm算法.
Aliphatic Solvent脂肪族溶劑.
Aluminium Nitride(AlN)氮化鋁.
Ambient Tamp環境溫度.
Amorphous無定形,非晶形.
Amp-Hour安培小時.
Analog Circuit/Analog Signal模擬電路/模擬訊號.
Anchoring Spurs著力爪.
Angle of Contack接觸角.
Angle of Attack攻角.
Anion陰離子.
Anisotropic異向性,單向的.
Anneal 韌化(退火).
Annular Ring孔環.
Anode陽極.
Anode Sludge陽極泥.
Anodizing陽極化.
ANSI美國標準協會.
Anti-Foaming Agent消泡劑.
Anti-pit Agent抗凹劑.
AOI自動光學檢驗.
Apertures開口,鋼版開口.
AQL品質允收水準.
AQL(Acceptable Quality Level)允收品質水準.
Aramid Fiber聚醯胺纖維.
Arc Resistance耐電弧性.
Array排列.
Artwork底片.
ASIC特定用途績體電路器.
Aspect Ratio縱橫比.
Assembly組裝裝配.
A-stage A階段.
ATE自動電測設備.
Attenuation訊號衰減.
Autoclave壓力鍋.
Axial-lead軸心引腳.
Azeotrope共沸混合液.
*****B*****
Back Light (Back Lighting)背光法.
Back Taper反錐斜角.
Backpanels, Backplanes支撐板.
Back-up 墊板.
Balanced Transmission Lines平衡式傳輸線.
Ball Grid Array球腳數組(封裝).
BＡndability彎曲性.
Banking Agent護岸劑.
Bare Chip Assembly裸體芯片組裝.
Barrel孔壁,滾鍍.
Base Material基材.
Basic Grid基本方格.
Batch批.
Baume波美度(凡液體比重比水重則 Be=145-(145÷Sp.Gr)
凡液體比重比水輕則 Be=140÷(Sp.Gr-130)
*Sp.Gr 為比重即同體績物質對"純水"1g/cm的比值).
Beam lead光芒式的平行密集引腳.
Bed-of-Nail Testing針床測試.
Bellows Conact彈片式接觸.
Beta Ray Backscatter貝他射線反彈散射.
Bevelling切斜邊.
Bias斜張綱布,斜纖法.
Bi-Level Stencil]雙階式鋼板.
Binder粘結劑.
Bits頭(Drill Bits).
Black Oxide黑氧化層.
Blanking沖空斷開.
Bleack 漂洗.
Bleeding溢流.
Blind Via Hole肓通孔.
Blister局部性分層或起泡.
Block Diagram電路系統塊圖 .
Blockout封綱.
Blotting干印.
Blotting Paper吸水紙.
Blow Hole吹孔.
Blue Plaque藍紋(錫面鈍化層).
Blur Edge (Circle)模糊邊帶(圈).
Bomb Sight彈標.
Bond Strength結合強度.
Bondability結合性.
Bonding Layer結合層接著層.
Bonding Sheet(Layer)接合片.
Bonding Wire結合線.
Bow, Bowing板彎.
Braid編線.
Brazing硬焊(用含銀的銅鋅合金焊條).
在425℃"870℃下進行熔接的方式).
Break Point顯像點.
Break-away Panel可斷開板.
Breakdown Voltage崩潰電壓.
Break-out破出.
Bridging搭橋.
Bright Dip光澤浸漬處理.
Brightener光澤劑.
Brown Oxide棕氧化.
Brush Plating刷鍍.
B-stageB階段.
Build Up Process增層法制程.
Build-up堆積.
Bulge鼓起.
Bump 突塊.
Bumping Process凸塊制程.
Buoyancy浮力.
Buried Via Hole埋導孔.
Burn-in高溫加速老化試驗.
Burning燒焦.
Burr毛頭.
Bus Bar匯電桿.
Butter Coat 外表樹脂層.
*****C*****
C4 Chip JointC4芯片焊接.
Cable電纜.
CAD計算機輔助設計.
Calendered Fabric軋平式綱布.
Cap Lamination帽式壓合法.
Capacitance電容.
Capacitive Coupling電容耦合.
Capillary Action毛細作用.
Carbide碳化物.
Carbon Arc Lamp碳弧燈.
Carbon Treatment, Active活化炭處理.
Card卡板.
Card Cages/Card Racks電路板構裝箱.
Carlson Pin卡氏定位稍.
Carrier載體.
Cartridge濾心.
Castallation堡型績體電路器.
Catalyzed Board, Catalyzed Substrate催化板材.
Catalyzing催化.
Cathode陰極.
Cation陰向離子, 陽離子.
Caul Plate隔板.
Cavitation空泡化 半真空.
Center-to-Center Spacing中心間距.
Ceramics陶瓷.
Cermet陶金粉.
Certificate證明書.
CFC氟氫碳化物.
Chamfer倒角.
Characteristic Impedance特性阻抗.
Chase綱框.
Check List檢查清單.
Chelate螯合.
Chemical Milling化學研磨.
Chemical Resistance抗化性.
Chemisorption化學吸附.
Chip芯片(粒).
Chip Interconnection芯片互連.
Chip on Board芯片粘著板.
Chip On Glass晶玻接裝(COG).
Chisel鉆針的尖部.
Chlorinated Solvent含氯溶劑,氯化溶劑.
Circumferential Separation環狀斷孔.
Clad/Cladding披覆.
Clean Room無塵室.
Cleanliness清潔度.
Clearance余地,余環.
Clinched Lead Terminal緊箝式引腳.
Clinched-wire Through Connection通孔彎線連接法 .
Clip Terminal繞線端接.
Coat, Coating皮膜表層.
Coaxial Cable同軸纜線.
Coefficient of Thermal Expansion熱膨脹系數.
Co-Firing共繞.
Cold Flow冷流.
Cold Solder Joint冷焊點.
Collimated Light平行光.
Colloid膠體.
Columnar Structure柱狀組織.
Comb Pattern梳型電路.
Complex Ion錯離子.
Component Hole零件孔.
Component Orientation零件方向.
Component Side組件面.
Composites,(CEM-1,CEM-3)復合板材.
Condensation Soldering凝熱焊接,液化放熱焊接.
Conditioning整孔.
Conductance導電.
Conductive Salt導電鹽.
Conductivity導電度.
Conductor Spacing導體間距.
Conformal Coating貼護層.
Conformity吻合性, 服貼性.Connector連接器.
Contact Angle接觸角.
Contact Area接觸區.
Contact Resistance接觸電阻.
Continuity連通性.
Contract Service協力廠,分包廠.
Controlled Depth Drilling定深鉆孔.
Conversion Coating 轉化皮膜.
Coplanarity共面性.
Copolymer共聚物.
Copper Foil銅皮.
Copper Mirror Test銅鏡試驗.
Copper Paste銅膏.
Copper-Invar-Copper (CIC)綜合夾心板.
Core Material內層板材,核材.
Corner Crack 通孔斷角.
Corner Mark板角標記.
Counterboring方型擴孔.
Countersinking錐型擴孔.
Coupling Agent 偶合劑.
Coupon, Test Coupon板邊試樣.
Coverlay/Covercoat表護層.
Crack裂痕.
Crazing白斑.
Crease皺折.
Creep潛變.
Crossection Area截面積.
Crosshatch Testing十字割痕試驗.
Crosshatching十字交叉區.
Crosslinking, Crosslinkage交聯,架橋.
Crossover越交,搭交.
Crosstalk噪聲, 串訊.
Crystalline Melting Point晶體熔點.
C-Stage C階段.
Cure硬化,熟化.
Current Density電流密度.
Current-Carrying Capability載流能力.
Curtain Coating濂涂法.
*****D*****
Daisy Chained Design菊瓣設計.
Datum Reference基準參考.
Daughter Board子板.
Debris碎屑,殘材.
Deburring去毛頭.
Declination Angle斜射角.
Definition邊緣逼真度.
Degradation 劣化.
Degrasing脫脂.
Deionized Water去離子水.
Delamination分離.
Dendritic Growth 枝狀生長.
Denier丹尼爾(是編織紡織所用各種紗類直徑單位,
定義9000米紗束所具有的重量(以克米計)).
Densitomer透光度計.
Dent凹陷.
Deposition 皮膜處理.
Desiccator干燥器.
Desmearing去膠渣.
Desoldering解焊.
Developer顯像液,顯像機.
Developing顯像 .
Deviation偏差.
Device電子組件.
Dewetting縮錫.
D-glassD玻璃.
Diaze Film偶氮棕片.
Dichromate重鉻 酸鹽.
Dicing芯片分割.
DicyＡndiamide(Dicy)雙氰胺.
Die 沖模.
Die Attach晶粒安裝.
Die Bonding晶粒接著.
Die Stamping沖壓.
Dielectric 介質.
Dielectric Breakdown Voltage介質崩潰電壓.
Dielectric Constant介質常數.
Dielectric Strength介質強度.
Differential Scanning Calorimetry(DSC)微差掃瞄熱卡分析法.
Diffusion Layer擴散層.
Digitizing數字化.
Dihedral Angle雙反斜角.
Dimensional Stability尺度安定性.
Diode二極管.
Dip Coating浸涂法.
Dip Soldering浸焊法.
DIP(Dual Inline Package)雙排腳封裝體.
Dipole偶極,雙極.
Direct / Indirect Stencil直接/間接版膜.
Direct Emulsion直接乳膠.
Direct Plating直接電鍍.
Discrete Compenent散裝零件.
Discrete Wiring Board散線電路板,復線板.
Dish Down碟型下陷.
Dispersant分散劑.
Dissipation Factor散失因素.
Disspation Factor散逸因子.
Disturbed Joint受擾焊點.
Doctor Blade修平刀,刮平刀.
Dog Ear狗耳.
Doping摻雜.
Double Layer雙電層.
Double Treated Foil雙面處理銅箔.
Drag In / Drag Out帶[進/帶出.
Drag Soldering拖焊.
Drawbridging吊橋效應.
Drift漂移.
Drill Facet鉆尖切削面.
Drill Pointer鉆針重磨機.
Drilled Blank已鉆孔的裸板.
Dross浮渣.
Drum Side銅箔光面.
Dry Film干膜.
Dual Wave Soldering 雙波焊接.
Ductility展性.
Dummy LＡnd假焊墊.
Dummy, Dummying假鍍(片).
Durometer橡膠硬度計.
DYCOstrate電漿蝕孔增層法.
Dynamic Flex(FPC)動態軟板.
*****E*****
E-Beam (Electron Beam)電子束.
Eddy Current渦電流.
Edge Spacing板邊空地.
Edge-Board Connector板邊(金手指)承接器.
Edge-Board Contact板邊金手指.
Edge-Dip Solderability Test板邊焊錫性測試.
EDTA乙二胺四乙酸.
Effluent排放物.
E-glass電子級玻璃.
Elastomer彈性體.
Electric Strength(耐)電性強度.
Electrodeposition電鍍.
Electro-deposition Photoresist電著光阻, 電泳光阻.
Electroforming電鑄.
Electroless-Deposition無電鍍.
Electrolytic Tough Pitch電解銅..
Electrolytic-Cleaning電解清洗.
Electro-migration電遷移.
Electro-phoresis電泳動, 電滲.
Electro-tinning鍍錫.
Electro-Winning電解冶煉.
Elongation 延伸性, 延伸率.
Embossing凸出性壓花.
EMF(Electromotive Force)電動勢.
EMI(Electromagnetic Interference)電磁干擾.
Emulsion乳化.
Emulsion Side藥膜面.
Encapsulating膠囊.
Encroachment沾污,侵犯.
End Tap封頭.
Entek有機護銅處理.
Entrapment夾雜物.
Entry Material蓋板.
Epoxy Resin環氧樹脂.
Etch Factor蝕刻因子.
Etchant蝕刻劑(液).
Etchback回蝕.
Etching Indicator蝕刻指針.
Etching Resist蝕刻阻劑.
Eutetic Composition共融組成.
Exotherm放熱(曲線).
Exposure曝光.
Eyelet鉚眼.
*****F*****
Fabric綱布.
Face Bonding反面朝下結合.
Failure故障.
Fan Out Wiring/Fan In Wiring扇出布線/扇入布線.
Farad 法拉.
Farady法拉第.
Fatigue Strength抗疲勞強度.
Fault缺陷.
Fault Plane斷層面.
Feed Through Hole導通孔.
Feeder 進料器.
Fiber Exposure玻纖顯露.
Fiducial Mark基準記號.
Filament纖絲.
Fill緯向.
Filler填充料.
Fillet內圓填角.
Film底片.
Film Adhesive接著膜,粘合膜.
Filter過濾器.
Fine Line細線.
Fine Pitch密腳距,密線距,密墊距.
Fineness粒度, 純度.
Finger手指.
Finishing終修(飾).
Finite Element Method有限要素分析法.
First Article首產品.
First Pass-Yield初檢良品率.
Fixture夾具.
Flair刃角變形.
Flame Point自燃點.
Flame Resistant耐燃性.
Flammability Rate燃性等級.
Flare扇形崩口.
Flash Plating閃鍍.
Flashover閃絡.
Flat Cable扁平排線.
Flat Pack扁平封裝(之零件).
Flatness平坦度.
Flexible Printed Circuit (FPC)軟板.
Flexural Failure撓曲損壞.
Flexural Module彎曲模數, 抗撓性模數 .
Flexural Strength抗撓強度.
Flip Chip覆晶,扣晶.
Flocculation絮凝.
Flood Stroke Print覆墨沖程印刷.
Flow Soldering (Wave Soldering)流焊.
Fluorescence熒光.
Flurocarbon Resin碳氟樹脂.
Flush Conductor嵌入式線路 , 貼平式 導體.
Flush Point閃火點.
Flute退屑槽.
Flux助焊劑.
Foil Burr銅箔毛邊.
Foil Lamination銅箔壓板法.
Foot殘足(干膜殘余物).
Foot Print (LＡnd Pattern)腳墊.
Foreign Material 外來物,異物.
Form-to-List布線說明清單.
Four Point Twisting四點扭曲法.
Free Radical自由基.
Freeboard干舷.
Frequency頻率.
Frit 玻璃熔料.
Fully-Additive Process全加成法.
Fungus Resistance抗霉性.
Fused Coating熔錫層.
Fusing熔合.
Fusing Fluid助熔液.
*****G*****
G-10由連續玻纖所織成的玻纖布與
環氧樹脂粘結劑所復合成的材料.
Gage, Gauge量規.
Gallium Arsenide (GaAs)砷化鎵.
Galvanic Corrosion賈凡尼式腐蝕(電解式腐蝕).
Galvanic Series賈凡尼次序(電動次序).
Galvanizing鍍鋅.
GAP第一面分離,長刃斷開.
Gate Array閘列,閘極數組.
Gel Time膠化時間.
Gelation Particle膠凝點.
Gerber Data ,Gerber File格博檔案(是美商Gerber公司專為PCB面線路
圖形與孔位,所發展一系列完整的軟件檔案).
Ghost Image陰影.
Gilding鍍金 (現為:Glod Plating).
Glass Fiber玻纖.
Glass Fiber Protrusion/Gouging, Groove玻纖突出/挖破.
Glass Transition Temperature, Tg玻璃態轉化溫度.
Glaze釉面,釉料.
Glob Top圓頂封裝體.
Glouble Test球狀測試法.
Glycol (Ethylene Glycol)乙二醇.
Golden Board測試用標準板.
Grain Size結晶粒度.
Grass Leak 大漏.
Grid標準格.
Ground Plane /Earth Plane接地層.
Ground Plane Clearance接地空環.
Guide Pin導針.
Gull /Wing Lead鷗翼引腳.
*****H*****
Halation環暈.
Half Angle半角.
Halide鹵化物.
Haloing白圈,白邊.
Halon海龍,是CFC"氟碳化物"的一種商品名.
Hard Anodizing硬陽極化.
Hard Chrome Plating鍍硬鉻.
Hard Soldering硬焊.
Hardener (Curing Agent)硬化劑(或Curing Agent).
Hardness硬度.
Haring-Blum Cell海固槽.
Harness電纜組合.
Hay Wire跳線.
Heat Cleaning燒潔.
Heat Dissipation散熱.
Heat Distortion Point (Temp)熱變形點(溫度).
Heat Sealing熱封.
Heat Sink Plane散熱層.
Heat Transfer Paste導熱膏.
Heatsink Tool散熱工具.
Hertz(Hz)赫.
High Efficiency Particulate Air Filter (HEPA)高效空氣塵粒過瀘機.
Hipot Test 高壓電測.
Hi-Rel高度靠度.
Hit 擊(鉆孔時鉆針每一次"刺下"的動作).
Holding Time停置時間.
Hole Breakout孔位破出.
Hole Counter數孔機.
Hole Density孔數密度.
Hole Preparation通孔準備.
Hole Pull Strength孔壁強度.
Hole Void破洞.
Hook 切削刀緣外凸.
Hot Air Levelling噴錫.
Hot Bar Soldering熱把焊接.
Hot Gas Soldering熱風手焊.
HTE(High Temperature Elongation)高溫延伸性.
Hull Cell哈氏槽.
Hybrid Integrated Circuit混成電路.
Hydraulic Bulge Test液壓鼓起試驗.
Hydrogen Embrittlement氫脆.
Hydrogen Overvoltage氫過(超)電壓.
Hydrolysis水解.
Hydrophilic親水性.
Hygroscopic吸濕性.
Hypersorption超吸咐.
*****I*****
I.C. Socket績體電路器插座.
Icicle錫尖.
Illuminance照度.
Image Transfer影像轉移.
Immersion Plating浸鍍.
Impedance阻抗.
Impedance Match阻抗匹配.
Impregnate含浸.
In-Circuit Testing組裝板電測.
Inclusion異物,夾雜物.
Indexing Hole基準孔.
Inductance(L)電感.
Infrared(IR)紅外線.
Input/Output輸入/輸出.
Insert, Insertion插接.
Inspection Overlay套檢底片.
Insulation Resistance絕緣電阻.
Integrated Circuit(IC)績體電路器.
Inter Face接口.
Interconnection互連.
Intermetallic Compound (IMC)接口共化物.
Internal Stress內應力.
Interposer互邊導電物.
Interstitial Via-Hole(IVH)局部層間導通孔.
Invar殷鋼(63.8%Fe,36%Ni,0.2%C).
Ion Cleanliness離子清潔度.
Ion Exchange Resins離子交換樹脂.
Ion Migration離子遷移.
Ionizable (Ionic) Contaimination離子性污染.
Ionization游離,電離.
Ionization Voltage (Corona Level)電離化電壓(電纜內部狹縫空氣中,引起其
電離所施加之最小電壓).
IPC美國印刷電路板協會.
Isolation隔離性,隔絕性.
*****J*****
JEDEC(Joint Electronic Device 聯合電子組件工程委員會.
Engineering Council)
J-LeadJ型接腳.
Job Shop專業工廠.
Joule焦耳.
Jumper Wire跳線.
Junction接(合)面,接頭.
Just-In-Time(JIT)適時供應,及時出現.
*****K*****
Kapton聚亞醯胺軟板.
Karat克拉 (1克拉(鉆石)=0.2g 純金則24k金為
100%的鈍金.
Kauri-Butanol Value考立丁醇值(簡稱K.B.值).
Kerf.切形,裁剪.
Kevlar聚醯胺纖維.
Key電鍵
Key Board鍵盤.
Kiss Pressure吻壓, 低壓.
Knoop Hardness努普硬度.
Known Good Die(KGD)已知之良好芯片.
Kovar科伐合金(Fe53%,Ni29%,Co17%).
Kraft Paper牛皮紙.
*****L*****
Lamda Wave延伸平波.
Laminar Flow平流.
Laminar Structure片狀結構.
Laminate Void板材空洞.
Laminate(s)基板.
Lamination Void壓合空洞.
Laminator壓膜機.
LＡnd孔環焊墊,表面焊墊.
LＡndless Hole無環通孔.
Laser Direct Imaging (LDI)雷射直接成像.
Laser Maching雷射加工法.
Laser Photogenerator(LPG), Laser Photoplotter雷射曝光機.
Laser Soldering雷射焊接法.
Lay Back 刃角磨損Lay Out布線,布局.
Lay Up 疊合.
Layer to Layer Spacing層間距離
Leaching焊散漂出,熔出.
Lead 引腳.
Lead Frame腳架.
Lead Pitch腳距.
Leakage Current漏電電流.
Legend文字標記.
Leveling整平.
Lifted LＡnd孔環(焊墊)浮起.
LigＡnd錯離子附屬體.
Light Emitting Diodes (led)發光二極管.
Light Integrator光能累積器.
Light Intensity光強度.
Limiting Current Density極限電流密度.
Liquid Crystal Display (LCD)液晶顯示器.
Liquid Dielectrics液態介質.
Liquid Photoimagible Solder Mask, (LPSM)液態感光防焊綠漆.
Local Area Network區域性網絡.
Logic 邏輯.
Logic Circuit 邏輯電路.
Loss Factor損失因素.
Loss Tangent (TanδDK)損失正切.
Lot Size批量.
Luminance發光強度.
Lyophilic親水性膠體.
*****M*****
Macro-Throwing Power巨觀分布力.
Major Defect主要(嚴重)缺點.
Major Weave Direction主要織向.
Margin刃帶(鉆頭尖部).
Marking標記.
Mask阻劑.
Mass Finishing大量整面(拋光).
Mass Lamination大型壓板.
Mass Transport質量輸送.
Master Drawing主圖.
Mat席(用于CEM-3(Composite Epoxy Material)的
復合材料.)
Matte Side毛面(電鍍銅皮(ED Foil)之粗糙面).
Mealing泡點.
Mean Time To Failure (MTTF)故障前可用之平均時數.
Measling白點.
Mechanical Stretcher機械式張網機.
Mechanical Warp機械式纏繞.
Mechanism機理.
Membrane Switch薄膜開關.
Meniscograph Test弧面狀沾錫試驗.
Meniscus彎月面.
Mercury Vaper Lamp汞氣燈.
Mesh Count綱目數.
Metal Halide Lamp 金屬鹵素燈.
Metallization金屬 化.
Metallized Fabric金屬化綱布.
Micelle微胞.
Micro Wire Board微封線板.
Micro-electronios微電子.
Microetching微蝕.
Microsectioning微切片法.
Microstrip 微條.
Microstrip Line微條線,微帶線.
Microthrowing Power微分布力.
Microwave微波.
Migration遷移.
Migration Rate遷移率.
Mil英絲.
Minimum Annular Ring孔環下限.
Minimum Electrical Spacing電性間距下限.
Minor Weave Direction次要織向.
Misregistration 對不準度.
Mixed Componmt Mounting Technology混合零件之組裝技術.
Modem調變及解調器.
Modification修改.
Module模塊.
Modulus of Elasticity彈性系數.
Moisture Ａnd Insulation Resistance Test濕氣與絕緣電阻試驗.
Mold Release 脫模劑,離型劑.
Mole摩爾.
Monofilament單絲.
Mother Board主機板,母板.
Moulded Circuit模造立體電路機.
Mounting Hole安裝孔.
Mounting Hole組裝孔,機裝孔.
Mouse Bite鼠齒(蝕刻后線路邊緣出現不規則缺口).
Multi-Chip-Module(MCM)多芯片芯片模塊.
Multiwiring Board (or Discrete Wiring Board)復線板.
*****N*****
N.C.數值控制.
Nail Head釘頭.
Near IR近紅外線.
Negative負片,鉆尖的第一面外緣變窄.
Negative Etch-back反回蝕.
Negative Stencil負性感光膜.
Negative-Acting Resist負性作用之阻劑.
Network綱狀元件.
Newton牛頓.
Newton Ring 牛頓環.
Newtonian Liquid牛頓流體.
Nick缺口.
N-Methyl Pyrrolidine (NMP)N-甲基四氫嗶咯.
Noble Metal Paste貴金屬印膏.
Node節點.
Nodule節瘤.
Nomencleature標示文字符號.
Nominal Cured Thickness標示厚度.
Non-Circular LＡnd非圓形孔環焊墊.
Non-flammable非燃性.
Non-wetting不沾錫.
Normal Concentration (Strength)標準濃度,當量濃度.
Normal Distribution常態分布.
Novolac酯醛樹脂.
Nucleation , Nucleating核化.
Numerical Control數值控制.
Nylon尼龍.
*****O*****
Occlusion吸藏.
Off-Contact架空.
Offset第一面大小不均.
OFHC(Oxyen Free High Conductivity)無氧高導電銅.
Ohm歐姆.
Oilcanning蓋板彈動.
OLB(Outer Lead Bond)外引腳結合.
Oligomer寡聚物.
Omega Meter離子污染檢測儀.
Omega Wave振蕩波.
On-Contact Printing密貼式印刷.
Opaquer不透明劑,遮光劑.
Open Circuits斷線.
Optical Comparater光學對比器(光學放大器.)
Optical Density光密度.
Optical Inspection光學檢驗.
Optical Instrument光學儀器.
Organic Solderability Preservatives (OSP)有機保焊劑.
Osmosis滲透.
Outgassing出氣,吹氣.
Outgrowth懸出,橫出,側出.
Output產出,輸出.
Overflow溢流.
Overhang總懸空.
Overlap 鉆尖點分離.
Overpotantial(Over voltage)過電位,過電壓.
Oxidation氧化.
Oxygen Inhibitor氧化抑制劑.
Ozone Depletion臭氧層耗損.
*****P*****
Packaging封裝,構裝.
Pad焊墊,圓墊.
Pad Master圓墊底片.
Pads Only Board唯墊板.
Palladium鈀.
Panel制程板.
Panel Plating全板鍍銅.
Panel Process全板電鍍法.
Paper Phenolic紙質酚醛樹脂(板材).
Parting Agent脫膜劑.
Passivation鈍化 ,鈍化外理.
Passive Device (Component)被動組件(零件)
Paste膏,糊.
Pattern板面圖形.
Pattern Plating線路電鍍.
Pattern Process線路電鍍法.
Peak Voltage峰值電壓.
Peel Strength抗撕強度.
Periodic Reverse (PR) Current周期性反電流.
Peripheral周邊附屬設備.
Permeability透氣性,導磁率.
Permittivity誘電率,透電率.
pH Value酸堿值.
Phase相.
Phase Diagram相圖.
Phenolic酚醛樹脂.
Photofugitive感光褪色.
Photographic film感光成像之底片.
Photoinitiator感光啟始劑.
Photomask光罩.
Photoplotter, Plotter光學繪圖機.
Photoresist光阻.
Photoresist Chemical Machinning (Milling)光阻式化學(銑刻)加工.
Phototool底片.
Pick Ａnd Place拾取與放置.
Piezoelectric壓電性.
Pin 插腳,插梢,插針.
Pin Grid Array (PGA)矩陣式針腳對裝.
Pinhole針孔.
Pink Ring粉紅圈.
Pitch跨距,腳距,墊距,線距.
Pits凹點.
Plain Weave平織.
Plasma電漿.
Plasticizers可塑劑,增塑劑.Plated Through Hole鍍通孔.
Platen熱盤.
Plating鍍.
Plotting標繪.
Plowing犁溝.
Plug插腳,塞柱.
Ply層,股.
Pneumatic Stretcher氣動拉伸器.
Pogo Pin伸縮探針.
Point 鉆尖.
Point Angle鉆尖面.
Point Source Light點狀光源.
Poise泊."粘滯度"單位=1dyne*sec/cm2.
Polar Solvent極性溶劑.
Polarity電極性.
Polarization分極,極化.
Polarizing Slot偏槽.
Polyester Films聚酯類薄片.
Polymer Thick Film (PTF)厚膜糊.
Polymerization聚合.
Polymide(PI)聚亞醯胺.
Popcorn Effect爆米花效應.
Porcelain瓷材,瓷面.
Porosity Test疏孔度試驗.
Positive Acting Resist正性光阻劑.
Post Cure后續硬化,后烤.
Post Separation后期分離,事后公離.
Pot Life運用期,鍋中壽命.
Potting鑄封,模封.
Power Supply電源供應器.
Preform 預制品.
Preheat預熱.
Prepreg膠片,樹脂片.
Press Plate鋼板.
Press-Fit Contact擠入式接觸.
Pressure Foot 壓力腳.
Pre-tinning預先沾錫.
Primary Image線路成像.
Print Through壓透,過度擠壓..
Probe探針.
Process Camera制程用照像機.
Process Window操作范圍.
Production Master生產底片.
Profile輪廓,部面圖,升溫曲線圖棱線.
Propagation傳播.
Propagation Delay傳播延遲.
Puddle Effect水坑效應.
Pull Away拉離.
Pulse Plating脈沖電鍍法.
Pumice Powder 浮石粉.
Punch沖切.
Purge, Purging凈空,凈洗.
Purple Plague紫疫(金與鋁的共化物層).
Pyrolysis熱裂解,高溫分解.
*****Q*****
Quad Flat Pack (QFP)方扁形封裝體.
Qualification Agency資格認證機構.
Qualification Inspection資格檢驗.
Qualified Products List合格產品(供應者)名單.
Qualitative Analysis定性分析.
Quality Conformance Test Circuitry (Coupon)品質符合之試驗線路(樣板).
Quantitative Analysis定量分析.
Quench 淬火,驟冷.
Quick Disconnect快速接頭.
Quill緯紗繞軸.
*****R*****
Rack 掛架.
Radial Lead放射狀引腳.
Radio Frequency Interference (RFI)射頻干擾.
Rake Angle摳角,耙角.
Rated Temperature, Voltage額定溫度,額定電壓.
Reactance電抗.
Real Estate底材面,基板面.
Real Time System 實時系統.
Reclaiming再生,再制.
Rediometer輻射計,光度計.
Reel to Reel卷輪(盤)式操作.
Reference Dimension參考尺度.
Reference Edge參考邊緣.
Reflection反射.
Reflow Soldering重熔焊接,熔焊.
Refraction折射.
Refractive Index折射率.
Register Mark對準用標記.
Registration對準度.
Reinforcement補強物.
Rejection剔退,拒收.
Relamination(Re-Lam)多層板壓合.
Relaxation松弛.緩和.
Relay繼電器.
Release Agent, Release Sheets脫模劑,離模劑.
Reliability可靠度,可信度.
Relief Angle浮角.
Repair修理.
Resin Coated Copper Foil背膠銅箔.
Resin Content膠含量,樹脂含量.
Resin Flow膠流量,樹脂流量.
Resin Recession樹脂下陷.
Resin Rich Area 多膠區,樹脂豐富區.
Resin Smear膠(糊)渣.
Resin Starve Area缺膠區,樹脂缺乏區.
Resist阻膜,阻劑.
Resistivity電阻系數,電阻率.
Resistor電阻器,電阻.
Resistor Drift電阻漂移.
Resistor Paste電阻印膏.
Resolution解像,解像度,分辨率.
Resolving Power解析(像)力,分辨力.
Reverse Current Cleaning反電流(電解)清洗.
Reverse Etchback反回蝕.
Reverse Image負片影像(阻劑).
Reverse Osmosis (RO)反(逆滲透).
Reversion反轉,還原.
Revision修正版.改訂版.
Rework(ing)重工,再加工.
Rhology流變學,流變性質.
Ribbon Cable圓線纜帶.
Rigid-Flex Printed Board硬軟合板.
Ring 套環.
Rinsing水洗,沖洗.
Ripple紋波(指整流器所輸出電流中不穩定成分).
Rise Time上升時間.
Roadmap 線路與零件之布局圖.
Robber輔助陰極.
Roller Coating輥輪涂布.
Roller Coating滾動涂布法.
Roller Cutter輥切機.
Roller Tinning輥錫法,滾錫法.
Rosin松香.
Rotary Dip Test擺動沾錫試驗.
Routing切外型.
Runout偏轉,累績距差.
Rupture迸裂.
*****S*****
Sacrificial Protection犧牲性保護層.
Salt Spray Test鹽霧試驗.
SＡnd Blast噴砂.
Saponification皂化作用.
Saponifier皂化劑.
Satin Finish緞面處理.
Scaled Flow Test比例流量實驗.
Schemetic Diagram電路概略圖.
ScoringV型刻槽.
Scratch刮痕.
Screen Printing綱版印刷.
Screenability綱印能力.
Scrubber磨刷機,磨刷器.
Scum透明殘膜.
Sealing封孔.
Secondary Side第二面 .
Seeding下種.
Selective Plating選擇性電鍍.
Self-Extinguishing自熄性.
Selvage布邊.
Semi-Additive Process半加成制程.
Semi-Conductor半導體.
Sensitizing敏化.
Separable Component Part可分離式零件.
Separator Plate隔板, 鋼板.
Sequential Lamination接續性壓合法.
Sequestering Agent螯合劑.
Shadowing陰影,回蝕死角.
Shank鉆針柄部.
Shear Strength 抗剪強度.
Shelf Life儲齡.
Shield遮蔽.
Shore Hardness蕭氏硬度.
Short短路.
Shoulder Angle肩斜角.
Shunt分路.
Side Wall側壁.
Siemens電阻值.
Sigma (StＡndard Deviation)標準差.
Signal訊號.
Silane硅烷.
Silica Gel硅膠砂.
Silicon硅.
Silicone硅銅.
Silk Screen綱版印刷,絲綱印刷.
Silver Migration銀遷移.
Silver Paste 銀膏.
Single-In-Line Package(SIP)單邊插腳封裝體.
Sintering燒結.
Sizing上膠,上漿.
Sizing上漿處理.
Skin Effect集膚效應 (高頻下,電流在傳遞時多集中在導體
表面,使得道線內部通過電流甚少, 造成內部導體
浪費,并也使得表面導體部分電阻升高.
Skip Printing, Skip Plating漏印,漏鍍.
Skip Solder 缺錫, 漏焊.
Slashing漿經.
Sleeve Jint套接.
Sliver邊絲,邊余.
Slot, Slotting槽口.
Sludge于泥.
Slump塌散.
Slurry稠漿,懸浮漿.
Small Hole小孔.
Smear膠渣.
Smudging錫點沾污.
Snap-off彈回高度.
Socket插座.
Soft Contact輕觸.
Soft Glass 軟質玻璃(鉛玻璃).
Solder焊錫.
Solder Ball錫球.
Solder Bridging錫橋.
Solder Bump 焊錫凸塊.
Solder Column Package錫柱腳封裝法.
Solder Connection焊接.
Solder Cost焊錫著層.
Solder Dam錫堤.
Solder Fillet填錫.
Solder Levelling噴錫,熱風整平.
Solder Masking(S/M)防焊膜綠漆.
Solder Paste錫膏.
Solder Plug錫塞(柱).
Solder Preforms預焊料.
Solder Projection焊錫突點.
Solder Sag 焊錫垂流物.
Solder Side焊錫面.
Solder Spatter濺錫.
Solder Splash賤錫.
Solder Spread Test散錫試驗.
Solder Webbing錫綱.
Solder Webbing錫綱.
Solder Wicking滲錫,焊錫之燈芯效應.
Solderability可焊性.
Soldering軟焊,焊接.
Soldering Fluid, Soldering Oil助焊液,護焊油.
Solid Content固體含量,固形分.
Solidus Line固相線.
Spacing間距.
Span跨距.
Spark Over閃絡.
Specific Heat 比熱.
Specification (Spec)規范,規格.
Specimen樣品,試樣.
Spectrophotometry分光光度計檢測法.
Spindle主軸,鉆軸.
Spinning Coating自轉涂布.
Splay斜鉆孔.
Spray Coating噴著涂裝.
Spur底片圖形邊緣突出.
Sputtering濺射.
Squeege刮刀.
Stagger Grid蹣跚格點.
Stalagometer滴管式表面張力計.
StＡnd-off Terminals直立型端子.
Starvation缺膠.
Static Eliminator靜電消除器.
Steel Rule Die(鋼)刀模.
Stencil版膜.
Step Ａnd Repeat逐次重復曝光.
Step Plating梯階式鍍層.
Step Tablet階段式曝光表.
Stiffener補強條(板).
Stop Off防鍍膜, 阻劑.
Strain變形,應變.
StrＡnd絞(指由許多股單絲集束并旋扭而成的絲束).
Stray Current迷走電流, 散雜電流(在電鍍槽系統中,其直流電
由整流器所提供,應在陽極板與被鍍件之間的匯
電桿與槽體液體中流通,但有時少部分電流也可能會
從槽體本身或加熱器上迷走,漏失).
Stress Corrosion應力腐蝕.
Stress Relief消除應力.
Strike預鍍.
Stringing拖尾.
Stripline條線.
Stripper剝除液(器).
Substractive Process減成法.
Substrate底材.
Supper Solder超級焊錫.
Supported Hole(金屬)支助通孔.
Surface Energy表面能.
Surface Insulation Resistance表面絕緣電阻.
Surface Mount Device 表面粘裝組件.
Surface Mounting Technology (SMT)表面粘裝技術.
Surface Resistivity表面電阻率.
Surface Speed鉆針表面速度.
Surface Tension表面張力.
Surfactant表面潤濕劑.
Surge突流,突壓.
Swaged Lead壓扁式引腳.
Swelling Agents, Sweller膨松劑.
Swimming 線路滑離.
Synthetic Resin合成樹脂.
*****T*****
Tab接點,金手指.
Taber Abraser泰伯磨試器.
Tackiness粘著性, 粘手性.
Tape Automatic Bonding (TAB)卷帶自動結合.
Tape Casting 帶狀鑄材.
Tape Test撕膠帶試驗.
Tape Up Master原始手貼片.
Taped Components卷帶式連載組件.
Taper Pin Gauge錐狀孔規.
Tarnish污化.
Tarnish 污化, 污著.
Teflon鐵氟龍(聚4氟乙烯).
Telegraphing浮印,隱印.
Temperature Profile溫度曲線.
Template模板.
Tensile Strength抗拉強度.
Tensiomenter張力計.
Tenting蓋孔法.
Terminal端子.
Terminal Clearance端子空環.
Tetra-Etch氟樹脂蝕粗劑.
Tetrafunctional Resin四功能樹脂.
Thermal Coefficient of Expansion (TCE)熱膨脹系數.
Thermal Conductivity導熱率.
Thermal Cycling熱循環,熱震蕩.
Thermal Mismstch感熱失諧.
Thermal Relief散熱式鏤空.
Thermal Via導熱孔.
Thermal Zone感熱區.
Thermocompression Bonding熱壓結合.
Thermocouple熱電偶.
Thermode發熱體.
Thermode Soldering熱模焊接法.
Thermogravimetric Analysis, (TGA)熱重分析法.
Thermomechanical Analysis (TMA)熱機分析法.
Thermoplastic熱塑性.
Thermosetting熱固性.
Thermosonic Bonding熱超音波結合.
Thermount聚醯胺短纖席材.
Thermo-Via導熱孔.
Thick Film Circuit厚膜電路.
Thief輔助陽極.
Thin Copper Foil薄銅箔.
Thin Core薄基板.
Thin Film Technology薄膜技術.
Thin Small Outline Package(TSOP)薄小型績體電路器.
Thinner調薄劑.
Thixotropy抗垂流性,搖變性.
Three Point Bending三點壓彎試驗.
Three-Layer Carrier三層式載體.
Threshold Limit Value (TLV)極限值.
Through Hole Mounting通孔插裝.
Through Put物流量,物料通過量.
Throwing Power分布力.
Tie Bar分流條.
Tin Drift錫量漂飄失.
Tin Immersion浸鍍錫.
Tin Pest錫疫(常見白色金屬錫為"β錫",當溫度低于13.2℃
時則β錫將逐漸轉變成粉末狀灰色"α錫"稱為"錫疫".
Tin Whishers錫須.
Tinning熱沾焊錫.
Tolerance公差.
Tombstoning墓碑效應.
Tooling Feature工具標示物.
Topography表面地形.
Torsion Strength抗扭強度.
Touch Up觸修,簡修.
Trace 線路,導線.
Traceability追溯性,可溯性.
Transducer轉能器.
Transfer Bump移用式突塊.
Transfer Laminatied Circuit轉壓式線路.
Transfer Soldering移焊法.
Transistor晶體管.
Translucency半透性.
Transmission Line傳輸線.
Transmittance透光率.
Treament, Treating含浸處理.
Treeing枝狀鍍物,鍍須.
Trim修整, 精修.
Trim Line裁切線.
Trimming修整,修邊.
True Position真位.
Tungsten鎢
Tungsten Carbide碳化鎢.
Turnkey System包辦式系統.
Turret Solder Terminal塔立式焊接端子.
Twill Weave斜織法.
Twist板扭.
Two Layer Carrier兩層式載體.
*****U*****
UL Symbol(UL.為Under-Writers 保儉業試驗所標志.
Laboratories,INC)
Ultimate Tensile Strength (UTS)極限抗拉強度.
Ultra High Frequency (UHF)超高頻率.
Ultra Violet Curing (UV Curing)紫外線硬化.
Ultrasonic Bonding超音波結合.
Ultrasonic Cleaning超音波清洗.
Ultrasonic Soldering超音波焊接.
Unbalanced Transmission Line非平衡式傳輸線.
Undercut, Undercutting側蝕.
Underplate底鍍層.
Universal Tester汛用型電測機.
Unsupported Hole非鍍通孔.
Urea尿素.
Urethane胺基甲酸乙脂.
Vacuoles焊洞.
Vacuum Evaporation(or Deposition)真空蒸鍍法.
Vacuum Lamination真空壓合.
Van Der Waals Force凡得華力.
Vapor Blasting蒸汽噴砂.
Vapor Degreasing蒸汽除油法.
Vapor Phase Soldering氣相焊接.
Varnish凡力水,清漆(樹脂之液態單體).
V-cutV型切槽.
Very Large-Scale Integration(VLSI)極大績體電路器.
Via Hole 導通孔.
Vickers Hardness維氏硬度.
Viscosity粘滯度,粘度.
Vision Systems視覺系統.
Visual Examination目視檢驗.
Void 破洞,空洞.
Volatile Content揮發份含量.
Voltage電壓.
Voltage Breakdown崩潰電壓.
Voltage Drop 電壓降落.
Voltage Efficiency電壓效率.
Voltage Plane電壓層.
Voltage Plane Clearance電壓層的空環.
Volume Resistivity體績電阻率.
Volume Resistivity體績電阻率.
Volumetric Analysis容量分析法.
Vulcanization交聯,硫化.
*****W*****
Wafer晶圓.
Waive暫準過關,暫不檢查.
Warp Size 漿經處理.
Warp, Warpage板彎.
Washer墊圈.
Waste Treatment廢棄處理.
Water Absorption吸水性.
Water Break水膜破散,水破.
Water Mark水印.
Watt瓦特.
Watts Bath瓦茲鍍鎳液.
Wave Guide導波管.
Wave Soldering波焊.
Waviness 波紋,波度.
Wear Resistance耐磨性,耐磨度.
Weatherability耐候性.
Weave Eposure織紋顯露.
Weave Texture織紋隱現.
Web蹼部.
Wedge Bond 楔形結合點.
Wedge Void楔形缺口(破口).
Weft Yarn緯紗.
Welding熔接.
Wet Blasting濕噴砂.
Wet Lamination濕壓膜法.
Wet Process濕式制程.
Wetting Agent潤濕劑.
Wetting Balance沾錫天平.
Wetting Balance沾錫,沾濕.
Whirl Brush旋渦式磨刷法.
Whirl Coating旋渦涂布法.
Whisker晶須.
White Residue白色殘渣.
White Spot白點.
Wicking燈蕊效應.
Window操作范圍,傳動齒孔.
Wiping Action 滑動接觸(導電).
Wire Bonding打線結合.
Wire Gauge線規.
Wire Lead金屬線腳.
Wire Pattern布線圖形.
Wire Wrap繞線互連.
Working Master工作母片.
Working Time (Life)堪用時間.
Workmanship 手藝,工藝水平,制作水準.
Woven Cable扁平編線.
Wrinkle皺折, 皺紋.
Wrought Foil鍛碾金屬箔.
*****X*****
X AxisX軸.
X-Ray X光.
X-Ray FluorescenceX螢光.
*****Y*****
Yarn紗線.
Y-AxisY軸.
Yield良品率,良率,產率.
Yield Point屈服點.
*****Z*****
Z-AxisZ軸.
Zero Centering中心不變(疊合法).
Zig-Zag In-Line Package (ZIP)煉齒狀雙排腳封裝件. |
|
發表于 2011-8-4 10:49:29
收藏
頂
踩
