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1.開料：CutLamination/Material cutting 2.鉆孔：Drilling 3.內鉆：Inner LayerDrilling 4一次孔:Outer Layer Drilling 5.二次孔:2nd Drilling 6.雷射鉆孔  aser Drilling /Laser Ablation 7.盲(埋)孔鉆孔:Blind & Buried Hole Drilling 8.干膜制程：PhotoProcess(D/F)/Dry Film 9.前處理 (Pretreatment) 10.壓膜  ry Film Lamination 11.曝光:Exposure 12.顯影 eveloping 13.去膜:Stripping 14.壓合：Lamination 15:黑化:Black OxideTreatment 16.微蝕:Microetching 17.鉚釘組合:eyelet 18.迭板 ay up 19.壓合 amination 20.后處理  ost Treatment 21.黑氧化:Black Oxide Removal 22.銑靶:spot face 23.去溢膠:resin flush removal 24.減銅：Copper Reduction 25.水平電鍍：HorizontalElectrolytic Plating 26.電鍍：Panel plating 27.錫鉛電鍍:Tin-Lead Plating /Pattern Plating 28.低于 1 mil: Less than 1 mil Thickness 29.高于 1 mil:More than 1 mil Thickness 30.砂帶研磨:Belt Sanding 31:剝錫鉛:Tin-Lead Stripping 32.微切片: Microsection 33.蝕銅:Etching 34.初檢:Touch-up 35.塞孔：Plug Hole 36.防焊(綠漆/綠油)：SolderMask 37.C面印刷 rinting Top Side 38.S面印刷 rinting Bottom Side 39.靜電噴涂:Spray Coating 40.前處理 retreatment 41.預烤 recure 42.后烘烤 ostcure 43.印刷:Ink Print 44.表面刷磨:Scrub 45.后烘烤 ostcure 46.UV烘烤:UV Cure 47.文字印刷 rinting of Legend 48.噴砂 umice/Wet Blasting 49.印可剝離防焊/藍膠 eelable Solder Mask) 50.化學前處理,化學研磨：Chemical Milling 51.選擇性浸金壓膜：Selective Gold Dry Film Lamination 52.鍍金：Gold plating 53.噴錫：Hot Air SolderLeveling 54.成型：Profile/Form 55.開短路測試：Electrical Testing 56.終檢：Final VisualInspection 57.金手指鍍鎳金：Gold Finger 58.電鍍軟金：Soft Ni/Au Plating 59.浸鎳金：Immersion Ni/Au / Electroless Ni/Au 60.噴錫:Hot Air Solder Leveling 61.水平噴錫:HorizontalHot Air Solder Leveling 62.垂直噴錫: Vertical Hot Air Solder Leveling 63.超級焊錫:Super Solder 64.印焊錫突點:Solder Bump 65.數控銑/鑼板：N/C Routing/Milling 66.模具沖/啤板：Punch 67.板面清洗烘烤：Cleaning & Backing 68.V型槽/V-CUT： V-Cut/V-Scoring 69.金手指斜邊：Beveling of G/F 70.短斷路測試Electrical Testing/Continuity & Insulation Testing 71.AOI 光學檢查：AOI Inspection 72：VRS 目檢：Verified & Repaired 73.泛用型治具測試：Universal Tester 74.專用治具測試：Dedicated Tester 75.飛針測試：Flying Probe 76.終檢：Final Visual Inspection 77.壓板翹：Warpage Remove 78.X-OUT 印刷：X-Out Marking 79.包裝及出貨：Packing& shipping 80.清洗及烘烤： Final Clean & Baking 81.銅面保護劑：ENTEK Cu-106A/OSP 82.離子殘余量測試:Ionic Contamination Test/ Cleanliness Test 83.冷熱沖擊試驗:Thermal cycling Testing 84.焊錫性試驗:Solderability Testing 85.雷射鉆孔 aser Ablation 86.雷射鉆Tooling孔 aser ablationTooling Hole 87.雷射曝光對位孔 aser Ablation Registration Hole 88.雷射Mask制作 aser Mask 89.雷射鉆孔 aser Ablation 90.AOI檢查及VRS:AOI Inspection & Verified & Repaired 91.除膠渣 esmear 92.專用治具測試 edicated Tester 93.飛針測試:Flying Probe 94.壓板翹: Warpage Remove 95.底片：Ablation 96.燒溶：laser) 97.切/磨：abrade 98.粗化：abrasion 99.耐磨性：absorption resistance 100.允收:ACC /accept 101.加速腐蝕:accelerated corrosion test 102加速試驗:accelerated test 103.速化反應:acceleration 104.加速劑:accelerator 105.允許：acceptable 106.活化液：activator 107.實際在制品：active work in process 108.附著力：adhesion 109.黏著法：adhesive method 110.氣泡:air inclusion 111.風刀：air knife 112.不定形的改變：amorphous change 113.總量：amount 114.硝基戊烷：amylnitrite 115.分析儀：analyzer 116環狀墊圈;孔環annular ring 117.陽極泥：anodeslime (sludge) 118.陽極清洗：anodizing 119.自動光學檢測：AOI/automatic optical inspection 120.引用之文件：applicable documents 121.允收水平抽樣：AQL sampling 122.液態光阻：aqueous photoresist 123.縱橫比(厚寬比)：aspect ratioAs received 124.背光：back lighting 125.墊板：back-up 126.預留在制品：banked work in process 127.基材：base material 128.基準績效：baseline performance 129.批：batch 130.貝他射線照射法：beta backscattering 131.切斜邊;斜邊：beveling 132.二方向之變形:biaxial deformation 133.黑化：black-oxide 134.空板：blank panel 135.挖空:blanking 136.彈開:blip 137.氣泡:blister blistering 138.吹孔:blow hole 139.板厚錯誤:board-thickness error 140.黏結層:bonding plies 141.板彎:bow ; bowing 142.破空:break out 143.搭橋;橋接：bridging 144.接單生產：BTO (Build To Order) 145,.燒焦：burning 146.毛邊(毛頭)：burr 147.碳化物：carbide 148.定位梢：carlson pin 149.載運劑：carrier 150.催化：catalyzing 151.陰極濺射法：catholicsputtering 152.隔板;鋼板：caul plate 153.校驗系統之各種要求：calibration system requirements 154.中心光束法：center beam method 155.集中式投射線：central projection 156.認證：certification 157.倒角 (金手指)：chamfer chamfer 158.切斜邊;倒角：chamfering 159.特性阻抗：characteristic impedance 160.電量傳遞過電壓：charge transfer overpotential 161.網框：chase 162.棋盤：checkboard 163.蟹和劑：chelator 164.化學鍵：chemical bond 165.化學蒸著鍍：chemical vapor deposition 166.圓周性之孔破：circumferential void 167.包夾金屬：clad metal 168.無塵室：clean room 169.間隙：clearance 170.表面處理：Coating/Surface Finish 上即是pcb設計中專業英譯術語之形狀與尺寸，下期預告：PCB設計中專業英譯術語之流程，更多更多行業信息可查閱快點學院訂閱號：eqpcb_cp。 
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